3M™ Thermally Conductive Acrylic Interface Pad 5590H-0.5N, White, 240 mm x 20 m x 0.5 mm, 1 Roll/Case
- 3M ID 7100183185
Details
Highlights
- Good softness and conformability to non-flat surfaces
- Excellent compressive stress relaxation
- Non-silicone acrylic elastomer
- Good dielectric performance
- Good surface tack leads to low thermal resistance at surface
- Thickness : 0.5 mm, 1.0 mm, 1.5 mm
- Excellent durability for long term thermal conductivity and electric insulation stability
- Flame retardant, certified to UL 94 V.0
3M™ Thermally Conductive Acrylic Interface Pad 5590H is a moderately conformable and medium-soft pad with high thermal conductivity of 2.8 W/m-K (3M test method). This pad consists of a slightly tacky acrylic elastomeric sheet filled with thermally conductive ceramic particles. It is designed to transfer heat from heat generating components to heat sinks and cooling devices, improving device reliability and extending the component's life.
3M™ Thermally Conductive Acrylic Interface Pad 5590H has a medium-soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance.The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Our family of 3M™ Thermally Conductive Acrylic Interface Pads provide low-outgassing and high-performance solutions compared to silicone. These acrylic pads have no siloxane VOC or oil bleeding, which are associated with silicone products and can often cause device failure. They are lightweight, making them ideal for applications with finer spacing requirements and a small footprint. 3M™ Thermally Conductive Acrylic Interface Pads have good electrical insulation properties to protect against electrical interference and device breakdown.
Recommended Applications:
Heat transfer between PCB and heat sink
Decrease of compression stress to electronic parts by thermal pad softness
Gap filling in electronic devices
Chip on film (COF) heat dissipation
Power electronic component thermal management
Examples:
LED displays
Electric vehicle (EV) batteries
Wireless charging units
Satellite navigation
Sensors
Process control equipment
Test & measurement devices
Specifications
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