3M™ Thermal Bonding Film 583
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Details
Highlights
- Flexible
- Heat or solvent activation
- Can be die-cut
- Slight surface tack
- Heat crosslinkable option
- Lower temperature lamination of the nitrile phenolic film range
3M™ Thermal Bonding Film 583 is a high strength, flexible, nitrile phenolic based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.
This hot melt film adhesive provides a strong, permanent bond to the surface to which it is applied. The adhesive can be used for splicing of glass fabric during PCB board manufacturing. Can be solvent activated in the uncured form.
Suggested applications
- Bond flex antenna and metal face plates to the chassis
Specifications
| Adhesive Type | Nitrile Phenolic |
| Application | Sealing, Bonding |
| Curing Temperature (Celsius) | 107 ℃, 107 ℉ |
| Industries | Electronics, General Industrial, Transportation |
| Maximum Operating Temperature (Celsius) | 150 ℃ |
| Nominal Adhesive Thickness (Metric) | 50.8 micron |
| Product Color | Brown |
| Product Form | Roll |
| Product Usage | Electronic Components, Consumer Electronics, Enclosures |
| Shear Strength | 14 Pound-Force Per Square Inch |
| Shelf Life | 18 Month |
| Storage Environment | Refrigeration Storage |
| Substrate | Metal, Rubber, Fabric, Plastic, PVC |
| Overall Length (Metric) | 54.9 Meter |
| Overall Thickness (Metric) | 5 Millimeter |
| Overall Width (Metric) | 25.4 Millimeter, 50.8 Millimeter, 101.6 Millimeter, 304.8 Millimeter |
Resources
3M™ Thermal Bonding Film 583Data Sheets
(PDF, 212KB)
